半田過少 未はんだの部分がランド面積の１/3以下のことリード（電極）の

半田過少
未はんだの部分がランド面積の１/3以
下のこと

リード（電極）の高さの１/3以上はんだ
が付いていること
チップ電極部の３／４以上濡れているこ
と（フィレットが確認できること）
Ｌリード前方にフィレットが確認できること

ผลลัพธ์ (อังกฤษ) 1:

Solder under Still more than 1/3 of the land area is part of the solderUnder thatMore than 1/3 height of the lead solderWith that Wet chip electrodes 3/4 or more.And (you can make sure fillets)L read ahead can make sure fillets

ผลลัพธ์ (อังกฤษ) 2:

Solder under-
un-solder part is one-third or more of the land area
that under the one-third more than the solder of the height of the lead (electrode) that are marked with this you are wet more than three quarters of the chip electrode portions and (fillet ) thing but it can be confirmed that the fillet can be confirmed in the L lead forward

ผลลัพธ์ (อังกฤษ) 3:

Insufficient solderWith 1 / 3 Landes area portion of solderIt is under theLead (electrode) of the height of 1 / 3 or more.It is withWetting of electrode tip portion is more than 3 / 4And it can be confirmed that the fillet.It can be confirmed that the lead L front fillet