カル・ランナ・ゲートレス at 1 2 3 is advantageous to use プランジャユニット・ポットレス, liquid resin molding is possible to damage the wire to the resin flow almost without reducing the thickness of the substrate at large, is advantageous in Article 4 stack without going round resin using release film, cleaning E pin. Les at 5, vacuum forming void-free
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