【発明の効果】【００２０】 本発明により、均一な配線膜を作製可能なスパ

【発明の効果】
【００２０】
本発明により、均一な配線膜を作製可能なスパッタリングターゲットに好適な銅材料を
提供することができる。本発明のスパッタリングターゲット用銅材料は、ＴＦＴ液晶パネ
ルなどに使用される大型の基板に対してスパッタリング工程で配線を作成する際に、従来
以上に均一に粒子を発生し、且つ、使用中においてもその粒子の発生頻度の変化が起こり
にくい。
本発明の上記及び他の特徴及び利点は、適宜添付の図面を参照して、下記の記載からよ
り明らかになるであろう。
【図面の簡単な説明】

ผลลัพธ์ (อังกฤษ) 1:

[Effect of invention][0020] Uniform wiring film fabricated invention by copper materials suitable for sputtering targets availableYou can provide. Sputtering targets for copper materials of the invention's TFT LCD PanelIn making the wiring in the sputtering process for large substrates used for Le legacy.Occurs and uniform particle more, and even while using a variation of the frequency of occurrence of the particle thing happensHard. Invention of the above and other features and advantages are from time to time see attached drawing from the below mentioned.Will become more evident.[Brief description of the drawings]

ผลลัพธ์ (อังกฤษ) 2:

Effect of the Invention
[0020]
According to the present invention, a suitable copper material to possible manufacturing sputtering target a uniform wiring film
can be provided. Copper material for the sputtering target of the present invention, TFT LCD panel
when creating a wiring by the sputtering process for a large substrate to be used such as Le, conventional
uniformly particles is generated above, and, during use also occur changes in the frequency of occurrence of the particles
difficult.
These and other features and advantages of the present invention, by appropriately referring to the accompanying drawings, yo from the following description
will become apparent Ri.
BRIEF DESCRIPTION OF THE DRAWINGS

ผลลัพธ์ (อังกฤษ) 3:

"Due to the effect of the present invention 】
【 】
can be uniform, and can produce the wiring film suitable for copper sputtering target material at the offer. Copper sputtering target material of the invention, when used in a liquid crystal panel at the TFT le to form the wiring in the sputtering process to the large substrate, the particles are uniformly and at more than before, during use and is hard to occur at the change of the frequency of occurrence the particle. The other features and advantages of the present invention, and.With reference to the drawings, as will become apparent from the following description. I. A simple method of drawing.