ＩＣ４にはハイブリッドＩＣを取り付けること。取り付け方法は下図に示すよ

ＩＣ４にはハイブリッドＩＣを取り付けること。取り付け方法は下図に示すように、
規定格印字面より向かって左側を１ピンとして取り付ける。取り付け後の傾きは
１０°以下とし、他部品との接触の無いこと。 また、下図の示す箇所に
ボンドを塗布し固定すること。この際他の部品にボンドが付着しないように
注意すること。尚、ボンド幅は５ｍｍ以上とする

ผลลัพธ์ (อังกฤษ) 1:

That hybrid IC fit IC4. The mounting method is shown belowTowards the prescribed price print surface than the left side pin 1 and the. After installing tiltBe less than 10 °, without contact with other parts. Also, in the locations shown belowThat bond and fixed. Do not contaminate the bond in this case other partsNote that the. In addition, bond width to 5 mm or more

ผลลัพธ์ (อังกฤษ) 2:

And be fitted with hybrid IC to IC4. As shown in the figure below, the mounting method
attach as one pin left side than the specified price printed surface. The slope of the installation after
a 10 ° or less, and there is no contact with other parts. Also, the location indicated by the figure below
which is fixed by applying the bond. Bond so that does not adhere to the other parts when this
thing to be careful. In addition, bond width and more than 5mm

ผลลัพธ์ (อังกฤษ) 3:

It is IC 4 hybrid IC. The mounting method, as shown in the lower part, the left side of the case under the printing surface is attached with a pin. After installation, the inclination and less than 10 degrees, so that there is no contact with the other parts. Also, at the lower portion of the fixed bond coating. Note that it does not adhere to other parts of the bond. The bond width is 5 mm or more.