【事実】・DG2ではDG1と違い、C/Hが無いため、成型圧によりZPP

【事実】
・DG2ではDG1と違い、C/Hが無いため、成型圧によりZPPがより圧填され、TTFPがDG1に比べ0.1～0.2msec程度遅くなる傾向にある。

・現在BWは２社（Heraeusu, Sigmund Cohn)から購入しており、HeraeusとSigmund Cohnでは、Sigmund Cohn製の方がTTFPが早い。
この理由は、Sigmund Cohn製の方がタングステンの割合が少ないためである。
つまり、抵抗温度係数がSigmundの方が高い。＝ TCRが高い



⇒このタングステンの割合の違いは、
Heraeusは、インゴット状態でのタングステンの割合で製造。インゴット（白金/タングステン混合後）状態での実測は、8±0.5%
Sigmund Cohnは、タングステン投入量を８％として合金製造。インゴット（白金/タングステン混合後）状態での実測は、7-7.5%。

⇒Sigmund Cohnで、材料投入時に比べ、インゴット状態でのタングステンの割合が減る理由は、溶融時に昇華してしまうためである。
このため、Heraeusでは、8+α%のタングステンを投入している。

【変更内容】
2013年末にSigmund Cohnより大幅な価格改定（0.151$/ft⇒0.231$/ft)の要求をされた。
今回、コストダウンとして、Heraeus社の比率を高くしたいが、Heraeus社のタングステンの割合は、他社を含めた標準仕様として8%と決まっているため、
タングステンの割合を減らす事は特別仕様となり価格が上がるため採用出来ない。

一方、イニシエータの抵抗値は客先要求のため変更できないが、抵抗率（Ω/m)を高くすることで、BWの長さが短くなり、同じ1.2Aの電流印加でも単位長さあたりの
エネルギー大きくなるため、BWの発熱速度が早くなり、TTFPも早くなる。
そこで、抵抗率を変える事で、TTFPを早期化し、コストダウンを図る。

ところでダイセルのBW仕様とSDI仕様は異なり、SDI仕様の方が、抵抗率が高い。
そのためSDIとBW仕様を共通化することで、更なるコストダウンが見込め、また実績もあるため、SDI仕様を採用する。

また、このB/Wを使用する際には、抵抗値を2.1Ωにしようとすると、ワイヤは短くなり、現状のヘッダーガラス径(2.37mm)では、規格を満足させる量産条件がない。
このため、SDIで実績のあるガラス径(2.29mm)を採用する。

ガラス径は、2.29mmより小さいと、ESD印加後に、ワイヤがピンに張り付き、抵抗が低下するため、この径とする。

ผลลัพธ์ (อังกฤษ) 1:

[Facts]And unlike DG1, DG2, c/h, by forming pressure ZPP is more pressure fillers TTFP is DG1 tends to be slower than 0.1~0.2msec around, and.-BW has now purchased from two companies (Heraeusu, Sigmund Cohn), Heraeus and Sigmund Cohn, Sigmund Cohn made of TTFP faster.The reason for this is Sigmund Cohn made the less percentage of tungsten for.In other words, is the temperature coefficient of resistance of Sigmund is higher. = High TCR⇒ is the difference between the percentage of these tungstenHeraeus produces at a rate of tungsten in ingots. Measured ingots (Platinum / tungsten mixed later) under the 8 ± 0.5%Sigmund Cohn is tungsten consumption as 8% alloy manufacture. Measured in ingot (Platinum / tungsten after mixing) is 7-7.5%.⇒ Why material when compared with ingots of tungsten proportion decreases at Sigmund Cohn is for would sublimate during melting.For this reason, Heraeus is 8 + α % tungsten has invested.[Changes]Price increase significantly more by the end of 2013 Sigmund Cohn (0.151 $ /ft ⇒ 0.231 $ /ft) of the request.For this time, as the cost ratio of the Heraeus company want high, percentage of the tungsten of the Heraeus company, as other companies, including standard and 8% haveNot used would reduce the percentage of tungsten special specifications and prices will go up.Resistivity (Ω m), but on the other hand, resistance values for initiator cannot change because of customer requests to increase reduces the length of the BW, the same 1.2 a current applied per unit of lengthFor energy becomes greater, faster heat release rate of BW, TTFP sooner.So by changing the resistivity, accelerate TTFP, to cut costs.By the way unlike BW specification of Daicel and SDI, SDI spec, resistivity is higher.For SDI and BW specification standardized by, possibility of further cost reductions also adopt SDI specification because there is actual.Also, when using this B/W, resistance to 2.1 Ω and wire was shortened and production conditions to satisfy the standard header glass current (2.37 mm), not.For this reason, adopt the glass (2.29 mm) actual a SDI.Glass size is 2.29 mm smaller and induced by ESD, wire pins, decreases the resistance to this size.

ผลลัพธ์ (อังกฤษ) 2:

[Fact]
Unlike in · DG2 DG1, for C / H is not, ZPP is more圧填by molding pressure, TTFP is in the 0.1 ~ 0.2msec about slower trend compared to DG1. • The current BW the two companies (Heraeusu, Sigmund Cohn) has been purchased from the Heraeus and Sigmund Cohn, who made ​​Sigmund Cohn is a fast TTFP. The reason for this is because people made ​​of Sigmund Cohn is a small percentage of tungsten. In other words, it is high resistance temperature coefficient of Sigmund. = TCR high ⇒ difference in the proportion of this tungsten, Heraeus, the production at a rate of tungsten in the ingot state. Ingot measured in (platinum / tungsten after mixing) state, 8 ± 0.5% Sigmund Cohn, the alloy manufacturing tungsten input as 8 percent. Ingot measured in (platinum / tungsten after mixing) state, 7-7.5%. In ⇒Sigmund Cohn, compared to when the material is turned on, the reason why the percentage of tungsten in the ingot state is reduced is in order to become sublimated at the time of melting. Therefore, in Heraeus, it is being charged 8 + α% tungsten. [Change] has been the request of the end of 2013 in significant price increases than Sigmund Cohn (0.151 $ / ft⇒0.231 $ / ft). This time, the cost, it is desired to increase the proportion of from Heraeus, the proportion of from Heraeus tungsten, since the fixed 8% as a standard specification, including companies, that reduce the proportion of tungsten becomes special specification Price It can not be employed in order to go up. Meanwhile, the resistance value of the initiator and can not be changed because of the customer's request, it is possible to increase the resistivity (Ω / m), the length of the BW is reduced, per unit length in the current application of the same 1.2A Energy In order to increase, faster heat release rate of BW is, TTFP even faster. Therefore, by changing the resistance to early of the TTFP, to reduce costs. By the way different Daicel of BW specifications and SDI specification, towards the SDI specification, high resistivity. Therefore By sharing the SDI and BW specifications, prospects for further cost-down, and because there is also proven to employ SDI specification. Also, when using this B / W, when attempting to resistance to 2.1Ω, the wire is shortened, the current state of the header glass diameter (2.37mm), there is no mass-production conditions to meet the standards. For this reason, it will adopt the glass diameter (2.29mm) with a proven track record in SDI. Glass size, and 2.29mm smaller, after the ESD is applied, the wire is sticking to the pin, since the resistance is reduced, and this diameter.